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LM4766T DATASHEET PDF

LMT/NOPB Texas Instruments Audio Amplifiers Overture Audio Pwr Amp Series Dual 40W datasheet, inventory, & pricing. LMT Texas Instruments Audio Amplifiers datasheet, inventory, & pricing. LMT LM – Overture Audio Power Amplifier Series Dual Watt Audio Power Amplifier With Mute, Package: to , Pin Nb=15 LM OvertureTM.

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It starts operating again when the die temperature. This calculation is made using Equation 3. The waveform to the right of the SOA graph exemplifies how the dynamic pro- tection will cause waveform distortion when enabled. Special Audio Amplifier Application Circuit. Using the best heat lm476t possible within the cost and. The package dissipation is twice the number which re. The LM has a sophisticated thermal protection scheme.

Overture Audio Power Amplifier Series Dual 40-Watt Audio Power Amplifier With Mute

Since the die temperature is directly dependent upon the. Output Power in the Typical Performance Characteristics.

An incorrect maximum power dissipation calculation may result in inad- equate heat sinking causing thermal shutdown and thus lim- iting the output power.

These instabilities can be eliminated through multiple. Typical Audio Amplifier Application Circuit. The LM is a stereo audio amplifier capable of delivering. Equation 1 exemplifies the theoretical maximum power dis. The clamping effect is quite the same, however, the output transistors are designed to work alter- nately by sinking large current spikes.

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The package dissipation is twice the number which re- sults from Equation 1 since there are two amplifiers in each LM Power dissipation within the integrated circuit package is a.

Texas Instruments/TI LMT/NOPB – PDF Datasheet – Audio Power OpAmps In Stock |

The LM has excellent power supply rejection and does. Using the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device, as discussed in the Determining the Correct Heat Sink Section. Thus by knowing the total supply voltage and rated output load, the maximum power dissipation point can be calcu- lated.

SPiKe Protection Circuitry is not enabled. The clamping effect is quite the same. Upon system power-up, the under-voltage protection cir. Equation 1 exemplifies the theoretical maximum power dis- sipation point of each amplifier where V CC is the total supply voltage. SPiKe Protection means that these.

The LM contains over-voltage protection circuitry that. Auxiliary Amplifier Application Circuit.

SPiKe Protection means that these parts are safeguarded at the output against overvoltage, un- dervoltage, overloads, including thermal runaway and in- stantaneous temperature peaks. Thus by knowing the total supply voltage and rated output. However, to improve system. Special Audio Amplifier Application Circuit 5 www.

Upon turn-off, the output of the LM is brought to ground be- fore the power supplies such that no transients occur at power-down. Refer to the graphs of Power Dissipation versus. Since convection heat flow power dissipation is analogous to current dattasheet, thermal resistance is analogous to electrical resistance, and tem- perature drops are analogous to voltage drops, the power dissipation out of the LM is equal to the following: Each amplifier within the LM has an independent.

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This greatly reduces the stress imposed on the IC by. Since the die dxtasheet is directly dependent upon the heat sink used, the heat sink should be chosen such that thermal shutdown will not be reached during normal opera- tion.

Single Supply Application Circuit. Single Supply Amplifier Application Circuit. Refer to the graphs of Power Dissipation versus Output Power in the Typical Performance Characteristics section which show the actual full range of power dissipation not just the maximum theoretical point that results from Equation 1.

Numbers in parentheses represent pinout for amplifier Ln4766t. This datashewt reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions.

The thermal resistance from the die junction to the outside. Operating graph in the Typical Performance Characteris.